(1)Product Exhibition WTL Sintered wick heatpipe WTL Axial grooved wick straight heatpipe WTL Axial grooved wick elbow heatpipe (2)Product Parameter Item Parameter Heat Pipe Length(mm) 230~900 Container Materials Cu Capillary Structure Axial grooved wick / Sintered wick / Screen wick Working Fluid WTL Cooled Medium Designed Operating Temperature(℃) 20~200 Designed Operating Inclination Angle(°) α> 5 Heat Transfer Capacity (Qmax) 50~1000w (depends on the product specs) Isothermal Test When heating in 50℃ water bath, the temperature difference between Evaporator section and adiabatic section is less than 2℃ Heat Resistance (℃/W) < 0.08 (as reference) Principle of Heat Transfer Capacity Test Testing Requirements 1)Heating input-power is supplied by the special delicate power adjustment; 2)heat pipe is placed with a α inclination angle; 3)when the fluctuate of the supervisory temperature on the outer shell is within 0.5℃ in 5min, the heat transfer process reaches its balance and the maximum heat transfer capacity (Qmax) is also defined simultaneously. (3)Sample Charts of Heat Transfer Characteristics Test Fig.1 Heat Transfer Capacity Test of HP with 700mm Length Fig.2 Isotherm Test of HP with 700mm Length

1、Heatpipe Heat Sink For Silicon Controlled With the fast development of the power and electronic industry, it is obvious that the large scale integration, assembly modularization and volume minimization are becoming a trend in integrated circuits, resulting in the increasingly larger dissipating heat of the power devices (such as silicon controlled rectifier SCR, silicon transistor, IGBT and etc.) Accordingly, higher requirements are put forward for the heat sink. To satisfy the requirements of the large heat dissipation, the HP heat sink with compact design is found to have higher efficiency, smaller volume and lighter weight, when compared with the traditional pure aluminum heat sink. WTL produces the HP heat sink (following the national standard) for the power devices, such as the SCR (Refer to the Fig.1 and Fig 2). Fig.1 Series Parallel Connection Composite System Fig.2 Six-phase Semiwave Rectification Circuit Composite System  

(1)Product Exhibition (2)Product Parameter Features 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs.  Application Heat Sink For Medium/High Voltage Inverter Operation Temperature(℃) 20~200 Heat Dissipated Power(w) According to customer requirements Thermal Resistance((℃/w) ≤0.015 Materials Substrate: Al/Cu Fin: Al/Cu HP shell: Cu Type of cooling Forced air cooling

(1)Product Exhibition (2)Product Parameter Features 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs.  Application Heatpipe Heat Sink For Mining Explosion Proof Inverter Operation Temperature(℃) 20~200 Heat Dissipated Power(w) 500~20000 Thermal Resistance((℃/w) ≤0.015 Materials Substrate:Al/Cu Fin: Cu HP shell: Cu Type of cooling Natural cooling/Forced air cooling