(1)Product Exhibition
(2)Product Parameter
Features |
1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs. |
Application |
Heatpipe heat sink for Plating Power Supply |
Operation Temperature(℃) |
20~200 |
Heat Dissipated Power(w) |
According to customer requirements |
Thermal Resistance((℃/w) |
≤0.03 |
Materials |
Substrate: Al/Cu Fin: Al HP shell: Cu |
Type of cooling |
Forced air cooling |
Outline Structure |