HP heat sink for Plating Power Supply

(1)Product Exhibition

(2)Product Parameter

Features

1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared with the normal pure aluminum heat sink in the same volume;

2. Simple structure and compact design; easy installation and low maintenance costs.

 Application

Heatpipe heat sink for Plating Power Supply

Operation Temperature(℃)

20~200

Heat Dissipated Power(w)

According to customer requirements

Thermal Resistance((℃/w)

≤0.03

Materials

Substrate: Al/Cu

Fin: Al

HP shell: Cu

Type of cooling

Forced air cooling

Outline Structure  

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