1、Heatpipe Heat Sink For Silicon Controlled With the fast development of the power and electronic industry, it is obvious that the large scale integration, assembly modularization and volume minimization are becoming a trend in integrated circuits, resulting in the increasingly larger dissipating heat of the power devices (such as silicon controlled rectifier SCR, silicon transistor, IGBT and etc.) Accordingly, higher requirements are put forward for the heat sink. To satisfy the requirements of the large heat dissipation, the HP heat sink with compact design is found to have higher efficiency, smaller volume and lighter weight, when compared with the traditional pure aluminum heat sink. WTL produces the HP heat sink (following the national standard) for the power devices, such as the SCR (Refer to the Fig.1 and Fig 2). Fig.1 Series Parallel Connection Composite System Fig.2 Six-phase Semiwave Rectification Circuit Composite System  

(1)Product Exhibition (2)Product Parameter Features 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs.  Application Heat Sink For Medium/High Voltage Inverter Operation Temperature(℃) 20~200 Heat Dissipated Power(w) According to customer requirements Thermal Resistance((℃/w) ≤0.015 Materials Substrate: Al/Cu Fin: Al/Cu HP shell: Cu Type of cooling Forced air cooling

(1)Product Exhibition (2)Product Parameter Features 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs.  Application Heatpipe Heat Sink For Mining Explosion Proof Inverter Operation Temperature(℃) 20~200 Heat Dissipated Power(w) 500~20000 Thermal Resistance((℃/w) ≤0.015 Materials Substrate:Al/Cu Fin: Cu HP shell: Cu Type of cooling Natural cooling/Forced air cooling

(1)Product Exhibition SVC SVG (2)Product Parameter Features 1. High heat dissipating efficiency, low thermal resistance, light weight; having larger heat dissipating capability when compared with the normal pure aluminum heat sink in the same volume; 2. Simple structure and compact design; easy installation and low maintenance costs.  Application Heatpipe heat sink for SVC/SVG Operation Temperature(℃) 20~200 Heat Dissipated Power(w) According to customer requirements Thermal Resistance((℃/w) ≤0.045 Materials Substrate: Al Fin: Al HP shell: Cu Type of cooling Natural cooling/Forced air cooling